- Turn low loss SiN into a low cost, high-speed versatile transceiver and processing platform for inter- and intra-DCI applications by equipping the platform with:
- two-layer SiN waveguide technology
- Plasmonic slot modulators
- Uni-Travelling Carrier PDs
- Demonstrate CMOS plasmonic Resonance Enhanced Modulators (REMs) and IQ modulators on SiN for 112Gbaud intra-and inter-DC interconnects
- Develop a mechanism for thermal stabilization (Plasmonic Thermal Stabilizer-PTS) of plasmonic REMs
- Deploy an optical 112Gbaud Coherent Receiver assisted by Optical Reservoir Neuromorphic Processing (NP) for DSP free operation
- Deploy low cost 112Gbaud PAM4 electronics for energy efficient transceivers
- Deploy 8-channel arrays of O-band and C-band modulators with flip-chip compatible optical I/O coupler
- Deploy a C-band SiP 8x112Gbaud-16 QAM (3.2Tb/s) transceiver for inter-DC interconnects
- Co-package of ASIC and 1.6Tbps O-band driverless transmitter for next Generation 50Tb/s switches
- Validate NEBULA transceiver technology in real world intra- and inter-DCI applications
